SOLDER CHECK ANALYSIS PROGRAMsolder_analysis_1

Periodic solder pot analysis is recommended to maintain solder pot integrity and to check for any contaminants that may have an effect on quality and solderability issues.  We recommend a solder analysis every 2 -3 months, depending on the amount of PCB’s processed.  Qualitek’s solder check-up program determines the level of solder impurities and tin level that helps identify any process or solder joint problems.  To best suit your needs, Qualitek offers several solder check-up programs leaded and lead-free pots.   Programs A, B and C are for leaded pots and programs LF-1, LF-2 and LF-3 are for lead-free pots (see tables below).  To purchase any of these programs, please visit our www.solderstoreonline.com website.

Buy $250.00 Worth of Solder Analysis Program & Receive One FREE Ladle Mold.

Limited time offer while supplies last!

SOLDER CHECK ANALYSIS PROGRAM

TIN/LEAD

Program A (Economical)                  Program B (Standard)                       Program C (Complete)

Elements                                             Program A Elements +                        Program A & B Elements +

Tin                                                       Silver                                                   Sulfur

Lead                                                    Aluminum                                           Phosphorus

Gold                                                     Arsenic

Copper                                                 Bismuth

Antimony                                             Cadmium

Iron

Indium

Nickel

Zinc

 

Above per IPC J-STD-001F Specifications

SOLDER CHECK ANALYSIS PROGRAM

LEAD-FREE

Program LF-1                                     Program LF-2                                     Program LF-3

Elements                                             Program LF-1 Elements +                   Program LF-1 & LF-2 Elements +

Tin                                                       Cadmium                                            Sulfur

Silver                                                   Bismuth                                               Phosphorus

Copper                                                Iron                                                     Germanium

Lead                                                    Nickel                                                  Cobalt

Antimony                                             Arsenic

Gold                                                     Zinc

Aluminum

Indium

 

Above per IPC J-STD-006C Specifications

 

Please submit the solder analysis form: solder_analysis