Delta RA300 wire solder contains a rosin activated core that is available with both lead-containing alloys and lead-free alloys. Wire solder formulation has extremely rapid wetting action and excellent flowing properties. Residues are non-corrosive and electrically non-conductive. RA300 conforms to IPC-J-STD-004B specifications.
Wire Solder RA
$17.46 – $59.27
Description
Qualitek utilizes state-of-the-art wire extrusion and wire drawing machines to manufacture low residue/fine diameter wire solders. Many of our formulations use the latest in no-clean/low residue technology found in our solder pastes and solder fluxes. We also developed our flux core manufacturing process to eliminate flux voids and irregular wire. Formulations are available for No-Clean, Water-Soluble, Rosin Mildly Activated, Super Activated Resin, and Rosin Activated. Solid wire is also available. Qualitek wire solders meet or exceed J-STD-004B. | View Product TDS & SDS |
Additional information
| Weight | 1 lbs |
|---|---|
| Dimensions | 2 × 2 × 4 in |
| Description | RA300, SN5/PB93.5/AG1.5, 0.032", 2.2% FLUX, 1LB. SPOOL, RA300, SN62/PB36/AG2, 0.025", 2.2% FLUX, 1LB. SPOOL, RA300, SN62/PB36/AG2, 0.032", 2.2% FLUX, 1LB. SPOOL, RA300, SAC305, 0.032", 3.3% FLUX, 1 LB. SPOOL, RA300, SN63/PB37, 0.032", 3.3% FLUX, 1LB. SPOOL, RA300, SN63/PB37, 0.062", 2.2% FLUX, 1LB. SPOOL, LEAD-FREE RA300, SAC305, .032", 2.2% FLUX, 1 LB. SPOOL, RA300, SAC305, 0.062", 2.2% FLUX, 1 LB. SPOOL, RA300, SN60/PB40, 0.032", 2.2% FLUX, 1 LB. SPOOL, RA300, SN60/PB40, 0.062", 2.2% FLUX, 1 LB. SPOOL, RA300, SN60/PB40, 0.062", 3.3% FLUX, 1 LB. SPOOL |
