Value Added Services2018-09-10T13:15:40+00:00

Value Added Services

With full lines of production equipment and materials, Qualitek International technicians/engineers are able to help customers from choosing the correct products for their application through their customized process of production. Local support plus materials, quick and convenient.

Value Added Services

With full lines of production equipment and materials, Qualitek International technicians/engineers are able to help customers from choosing the correct products for their application through their customized process of production. Customers such as Kenny Honore from Tahiti and from Skokie IL is happy to vouch for Qualitek’s value added service program as Qualitek was able to help first hand with local support applying parts to repair I-phones for resale. Local support plus materials, quick and convenient.

Profiling

Qualitek will assist customers in optimizing their reflow oven set up for their specific application using M.O.L.E. profiling system and software.  Qualitek engineers will assist in providing optimal reflow profiles that meet your needs for any alloy.

X-Ray

Qualitek offers an on-site X-Ray Inspection Service to allow customers to navigate complex Printed Circuit Boards and Electronic Components to detect trace defects, counterfeit parts, short circuits and voiding.  Qualitek has a state-of-the-art X-ray equipment (Jewel Box) that will assist customers in detecting defects (voiding) in BGA packaging technology.  X-Ray technology also has the ability to determine component placement and verify rework results.

Profiling

Qualitek will assist customers in optimizing their reflow oven set up for their specific application using M.O.L.E. profiling system and software.  Qualitek engineers will assist in providing optimal reflow profiles that meet your needs for any alloy.

X-Ray

Qualitek offers an on-site X-Ray Inspection Service to allow customers to navigate complex Printed Circuit Boards and Electronic Components to detect trace defects, counterfeit parts, short circuits and voiding.  Qualitek has a state-of-the-art X-ray equipment (Jewel Box) that will assist customers in detecting defects (voiding) in BGA packaging technology.  X-Ray technology also has the ability to determine component placement and verify rework results.

Solder Recycling Program

Qualitek’s solder recycling program provides customers with a convenient method of disposal of solder dross, solder pot waste and expired (used or unused) solder paste scrap.  Our recycling is performed on site so customers receive maximum return on the settlement statement.  Final payout is determined by the amount of material received and recovered.  A check may be issued or credit applied towards your next purchase of Qualitek soldering products.  Green and/or black buckets may be purchased for $6.50 each.  Click below on the Qualitek Solder Recycling Program that describes step by step instructions on how our recycling program works.

Qualitek Solder Recycling Program

Solder Recycling Program

Qualitek’s solder recycling program provides customers with a convenient method of disposal of solder dross, solder pot waste and expired (used or unused) solder paste scrap.  Our recycling is performed on site so customers receive maximum return on the settlement statement.  Final payout is determined by the amount of material received and recovered.  A check may be issued or credit applied towards your next purchase of Qualitek soldering products.  Green and/or black buckets may be purchased for $6.50 each.  Click below on the Qualitek Solder Recycling Program that describes step by step instructions on how our recycling program works.

Qualitek Solder Recycling Program

Solder Check Analysis Program

Periodic solder pot analysis is recommended to maintain solder pot integrity and to check for any contaminants that may have an effect on quality and solderability issues.  We recommend a solder analysis every 2 -3 months, depending on the amount of PCB’s processed.  Qualitek’s solder check-up program determines the level of solder impurities and tin level that helps identify any process or solder joint problems.  To best suit your needs, Qualitek offers several solder check-up programs leaded and lead-free pots.   Programs A, B and C are for leaded pots and programs LF-1, LF-2 and LF-3 are for lead-free pots (see tables below).

Tin/Lead

Program A (Economical) Program B (Standard) Program C (Complete)
Elements Program A Elements + Program A & B Elements +
Tin Silver Sulfur
Lead Aluminum Phosphorus
Gold Arsenic
Copper Bismuth
Antimony Cadmium
Iron
Indium
Nickel
Zinc

Above per IPC J-STD-001F Specifications

Lead-Free

Program LF-1 Program LF-2 Program LF-3
Elements Program LF-1 Elements + Program LF-1 & Lf-2 Elements +
Tin Cadmium Sulfur
Silver Bismuth Phosphorus
Copper Iron  Germanium
Lead Nickel Cobalt
Antimony Arsenic
Gold Zinc
Aluminum
Indium

Above per IPC J-STD-006C Specifications

Solder Check Analysis Program

Periodic solder pot analysis is recommended to maintain solder pot integrity and to check for any contaminants that may have an effect on quality and solderability issues.  We recommend a solder analysis every 2 -3 months, depending on the amount of PCB’s processed.  Qualitek’s solder check-up program determines the level of solder impurities and tin level that helps identify any process or solder joint problems.  To best suit your needs, Qualitek offers several solder check-up programs leaded and lead-free pots.   Programs A, B and C are for leaded pots and programs LF-1, LF-2 and LF-3 are for lead-free pots (see tables below).

Tin/Lead

Program A (Economical) Program B (Standard) Program C (Complete)
Elements Program A Elements + Program A & B Elements +
Tin Silver Sulfur
Lead Aluminum Phosphorus
Gold Arsenic
Copper Bismuth
Antimony Cadmium
Iron
Indium
Nickel
Zinc

Above per IPC J-STD-001F Specifications

Lead-Free

Program LF-1 Program LF-2 Program LF-3
Elements Program LF-1 Elements + Program LF-1 & Lf-2 Elements +
Tin Cadmium Sulfur
Silver Bismuth Phosphorus
Copper Iron  Germanium
Lead Nickel Cobalt
Antimony Arsenic
Gold Zinc
Aluminum
Indium

Above per IPC J-STD-006C Specifications

Please submit the solder analysis form: solder_analysis